US 12,227,683 B2
Connector production method and adhesive film
Tetsuyuki Shirakawa, Tokyo (JP); Hiroyuki Izawa, Tokyo (JP); Takuya Mori, Tokyo (JP); and Kenta Kikuchi, Tokyo (JP)
Appl. No. 17/781,729
Filed by Resonac Corporation, Tokyo (JP)
PCT Filed Dec. 3, 2020, PCT No. PCT/JP2020/045075
§ 371(c)(1), (2) Date Jun. 2, 2022,
PCT Pub. No. WO2021/112188, PCT Pub. Date Jun. 10, 2021.
Claims priority of application No. 2019-221309 (JP), filed on Dec. 6, 2019.
Prior Publication US 2023/0002644 A1, Jan. 5, 2023
Int. Cl. C09J 7/38 (2018.01); C09J 9/02 (2006.01)
CPC C09J 7/38 (2018.01) [C09J 9/02 (2013.01); C09J 2203/326 (2013.01); C09J 2301/302 (2020.08); C09J 2301/314 (2020.08); C09J 2301/408 (2020.08)] 8 Claims
OG exemplary drawing
 
1. A method of producing a connected body, comprising:
disposing an adhesive film between a first electronic member having a first electrode and a second electronic member having a second electrode; and
pressure-bonding the second electronic member to the first electronic member via the adhesive film so that the second electrode is electrically connected to the first electrode,
wherein
the first electronic member has an indented surface,
the first electrode is provided in a depressed portion of the indented surface, the depressed portion having a depth of 25 μm or more, and
the second electrode is an electrode having a substantially flat surface having an area larger than an area of the first electrode, and
wherein
the adhesive film comprises:
first conductive particles that are dendritic conductive particles; and
second conductive particles that are conductive particles other than the first conductive particles, each second conductive particle comprising a non-conductive core and a conductive layer provided on the core, and
the second conductive particles have an average particle diameter of 25 μm or more and the average particle diameter of the second conductive particles is not less than the depth of the depressed portion.