US 12,227,679 B2
Surface activated bonding method by ion or atom bombardment of a first surface of a first substrate to a second surface of a second substrate
Frank Fournel, Grenoble (FR); Karine Abadie, Grenoble (FR); and Quentin Lomonaco, Grenoble (FR)
Assigned to COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR)
Filed by COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR)
Filed on Feb. 28, 2023, as Appl. No. 18/175,882.
Claims priority of application No. 2201744 (FR), filed on Feb. 28, 2022.
Prior Publication US 2023/0272243 A1, Aug. 31, 2023
Int. Cl. H01L 21/18 (2006.01); C09J 5/04 (2006.01)
CPC C09J 5/04 (2013.01) [H01L 21/187 (2013.01); C09J 2301/416 (2020.08); C09J 2400/10 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A surface activated bonding method by ion or atom bombardment of a first surface of a first substrate to a second surface of a second substrate, the material of the first substrate at the first surface comprising at least two chemical species, one of which is a species of interest that becomes depleted upon activation by ion or atom bombardment, the method comprising:
depositing a layer of the species of interest onto the first surface of the first substrate;
activating the first surface by bombarding the first surface with an ion or atom beam so as to consume the entire previously deposited layer of the species;
activating the second surface by bombarding the second surface with an ion or atom beam, and
contacting the first surface of the first substrate with the second surface of the second substrate.