	US 12,227,678 B2
	Laminate peeling method, laminate, and laminate production method
Kazuhiro Sawada, Toyama (JP); Shunsuke Moriya, Toyama (JP); and Tetsuya Shinjo, Toyama (JP)
Assigned to NISSAN CHEMICAL CORPORATION, Tokyo (JP)
Appl. No. 17/294,129
Filed by NISSAN CHEMICAL CORPORATION, Tokyo (JP)
PCT Filed Nov. 14, 2019, PCT No. PCT/JP2019/044641 § 371(c)(1), (2) Date May 14, 2021, PCT Pub. No. WO2020/100965, PCT Pub. Date May 22, 2020.
Claims priority of application No. 2018-215862 (JP), filed on Nov. 16, 2018.
Prior Publication US 2022/0002591 A1, Jan. 6, 2022
Int. Cl. C09J 5/04 (2006.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01); B32B 43/00 (2006.01); C09J 125/06 (2006.01); C09J 169/00 (2006.01); C09J 183/04 (2006.01); H01L 21/683 (2006.01)

CPC C09J 5/04 (2013.01) [B32B 7/12 (2013.01); B32B 37/12 (2013.01); B32B 43/006 (2013.01); C09J 125/06 (2013.01); C09J 169/00 (2013.01); C09J 183/04 (2013.01); H01L 21/6836 (2013.01); B32B 2457/14 (2013.01); C09J 2425/00 (2013.01); C09J 2469/00 (2013.01); C09J 2483/00 (2013.01); H01L 2221/68386 (2013.01)]

4 Claims

1. A laminate debonding method, the method comprising:

producing a laminate by joining a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate which allows passage of infrared laser light, by the mediation of a first adhesive layer provided on the first substrate and a second adhesive layer provided on the second substrate, wherein:

the first adhesive layer is an adhesive layer obtained by curing an adhesive (A) containing a component which is cured through hydrosilylation, and

the second adhesive layer is an adhesive layer which is obtained by use of an adhesive (B) formed of a polymer adhesive having an aromatic ring in at least one of a main chain and a side chain and which allows passage of infrared laser light; and

irradiating the laminate with infrared laser light from a second substrate side for debonding the second substrate at the interface between the first and second adhesive layers.