US 12,227,672 B2
Method for manufacturing a multilayer ceramic capacitor
Tae Gyun Kwon, Suwon-si (KR); Eung Seok Lee, Suwon-si (KR); So Hyeon Hong, Suwon-si (KR); and Byung Rok Ahn, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Dec. 23, 2021, as Appl. No. 17/561,007.
Claims priority of application No. 10-2021-0126518 (KR), filed on Sep. 24, 2021.
Prior Publication US 2023/0098422 A1, Mar. 30, 2023
Int. Cl. H05K 3/30 (2006.01); C09D 5/24 (2006.01); C09D 7/20 (2018.01); C09D 7/40 (2018.01); C09D 7/45 (2018.01); C09D 129/04 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01); H01G 4/248 (2006.01)
CPC C09D 5/24 (2013.01) [C09D 7/20 (2018.01); C09D 7/45 (2018.01); C09D 7/68 (2018.01); C09D 7/69 (2018.01); C09D 129/04 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01); H01G 4/248 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method for manufacturing a multilayer ceramic capacitor, comprising:
an operation of preparing a ceramic green sheet;
an operation of forming a conductive paste on the ceramic green sheet;
an operation of forming a ceramic laminate by stacking a ceramic green sheet on which the conductive paste is formed;
an operation of sintering the ceramic laminate; and
an operation of forming an external electrode on an exterior of the ceramic laminate, wherein the conductive paste includes a first mixture including a metal powder, a dispersant, and a hydrophobic solvent and a second mixture including a hydrophilic binder and a hydrophilic solvent, the conductive paste being an emulsion in which the first mixture is dispersed in the second mixture.