US 12,227,645 B2
Polyamide resin composition and molded product comprising same
Sang Hwa Lee, Uiwang-si (KR); Ho Geun Park, Uiwang-si (KR); and Yeong Deuk Seo, Uiwang-si (KR)
Assigned to Lotte Chemical Corporation, Seoul (KR)
Appl. No. 17/598,447
Filed by LOTTE CHEMICAL CORPORATION, Seoul (KR)
PCT Filed Mar. 25, 2020, PCT No. PCT/KR2020/004062
§ 371(c)(1), (2) Date Sep. 27, 2021,
PCT Pub. No. WO2020/197261, PCT Pub. Date Oct. 1, 2020.
Claims priority of application No. 10-2019-0035581 (KR), filed on Mar. 28, 2019; and application No. 10-2020-0003444 (KR), filed on Jan. 10, 2020.
Prior Publication US 2022/0186026 A1, Jun. 16, 2022
Int. Cl. C08L 77/06 (2006.01)
CPC C08L 77/06 (2013.01) [C08L 2203/20 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A polyamide resin composition comprising:
about 100 parts by weight of a polyamide resin comprising about 5 wt % to about 40 wt % of an aromatic polyamide resin and about 60 wt % to about 95 wt % of an aliphatic polyamide resin;
about 30 to about 70 parts by weight of inorganic fillers; and
about 0.5 to about 5 parts by weight of a modified polyalkylene glycol, the modified polyalkylene glycol comprising an isocyanate group, a succinimide group or an epoxy group at at least one terminal of polyalkylene glycol,
wherein a weight ratio of the aromatic polyamide resin to the aliphatic polyamide resin is in the range of about 1:2 to about 1:15, and
wherein a weight ratio of the polyamide resin to the modified polyalkylene glycol is in the range of about 30:1 to about 40:1.