US 12,227,617 B2
Polyamide resin, composition, and molded article
Tatsuya Tochihara, Niigata (JP); and Nobuhiko Matsumoto, Hiratsuka (JP)
Assigned to Mitsubishi Gas Chemical Company, Inc., Tokyo (JP)
Appl. No. 17/424,768
Filed by Mitsubishi Gas Chemical Company, Inc., Tokyo (JP)
PCT Filed Nov. 26, 2019, PCT No. PCT/JP2019/046049
§ 371(c)(1), (2) Date Jul. 21, 2021,
PCT Pub. No. WO2020/152974, PCT Pub. Date Jul. 30, 2020.
Claims priority of application No. 2019-008315 (JP), filed on Jan. 22, 2019.
Prior Publication US 2022/0064377 A1, Mar. 3, 2022
Int. Cl. C08G 69/32 (2006.01)
CPC C08G 69/32 (2013.01) 16 Claims
 
1. A polyamide resin comprising a constituent unit derived from a diamine and a constituent unit derived from a dicarboxylic acid,
wherein 90 mol % or more of the constituent unit derived from the diamine is derived from a xylylenediamine, and 90 mol % or more of the constituent unit derived from the dicarboxylic acid is derived from a phenylenediacetic acid; and
X+(Y/3) is 68 or more, when X mol % is defined as a proportion of a constituent unit derived from 1,4-phenylenediacetic acid in the constituent unit derived from the dicarboxylic acid, and Y mol % is defined as a proportion of a constituent unit derived from p-xylylenediamine in the constituent unit derived from the diamine,
wherein 60 to 100 mol % of the xylylenediamine is m-xylylenediamine, and 40 to 0 mol % of the xylylenediamine is p-xylylenediamine, and
wherein the polyamide resin has a melting point of 338° C. or less.