US 12,227,609 B2
Thermosetting resin composition, thermosetting resin film, thermoset film, multilayer body, printed wiring board and method for producing same
Fumiya Kono, Otsu (JP); and Masayoshi Kido, Settsu (JP)
Assigned to KANEKA CORPORATION, Osaka (JP)
Filed by KANEKA CORPORATION, Osaka (JP)
Filed on Feb. 1, 2022, as Appl. No. 17/590,111.
Application 17/590,111 is a continuation of application No. PCT/JP2020/029365, filed on Jul. 30, 2020.
Claims priority of application No. 2019-142306 (JP), filed on Aug. 1, 2019.
Prior Publication US 2022/0153909 A1, May 19, 2022
Int. Cl. C09D 175/12 (2006.01); C08G 18/10 (2006.01); C08G 18/44 (2006.01); C08G 73/08 (2006.01); C09D 5/44 (2006.01); C09D 125/08 (2006.01)
CPC C08G 18/10 (2013.01) [C08G 18/44 (2013.01); C08G 73/08 (2013.01); C09D 5/4449 (2013.01); C09D 125/08 (2013.01); C09D 175/12 (2013.01)] 18 Claims
 
1. A thermosetting resin composition comprising:
a component (A) that is a compound having an imide group and a carboxy group in one molecule; and
a component (B) that is a polymer having a repeating unit represented by the following general formula (1):

OG Complex Work Unit Chemistry
wherein in the general formula (1), R1 and R2 are each independently a hydrogen atom or a methyl group; R3 is a hydrogen atom or any substituent, and a plurality of R3s may be bonded to form a ring structure; R4 is a hydrogen atom or an alkyl group; and m and n are each independently an integer of 1 or more, and m/n is 1 to 50,
wherein an amount of the component (B) in the thermosetting resin composition is 100 to 3000 parts by mass based on 100 parts by mass of a solid content of the component (A), and
wherein a molar ratio of a total amount of carboxy groups in the thermosetting resin composition to an amount of oxazoline groups in the component (B) is 0.1 to 3.0.