US 12,227,446 B2
Method of fabricating a through glass via on a suspended nanocrystalline diamond
Stoffel Dominique Janssens, Okinawa (JP); David Vazquez-Cortes, Okinawa (JP); Alessandro Giussani, Okinawa (JP); and Eliot Martin Fried, Okinawa (JP)
Assigned to OKINAWA INSTITUTE OF SCIENCE AND TECHNOLOGY SCHOOL CORPORATION, Okinawa (JP)
Appl. No. 17/606,380
Filed by OKINAWA INSTITUTE OF SCIENCE AND TECHNOLOGY SCHOOL CORPORATION, Okinawa (JP)
PCT Filed Apr. 14, 2020, PCT No. PCT/JP2020/016402
§ 371(c)(1), (2) Date Oct. 25, 2021,
PCT Pub. No. WO2020/222297, PCT Pub. Date Nov. 5, 2020.
Claims priority of provisional application 62/839,768, filed on Apr. 28, 2019.
Prior Publication US 2022/0212982 A1, Jul. 7, 2022
Int. Cl. C03C 17/22 (2006.01); C03C 15/00 (2006.01); C03C 23/00 (2006.01); C03C 25/6208 (2018.01)
CPC C03C 17/22 (2013.01) [C03C 15/00 (2013.01); C03C 23/0025 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method of fabricating a through glass via on a suspended nanocrystalline diamond, comprising:
configuring a glass substrate to have an etching side and a growth side;
locally etching the glass substrate on the etching side;
performing the local etching until achieving a predetermined substrate thickness;
creating a plurality of blind holes of a predetermined diameter and predetermined depth into the glass substrate by laser ablation or modifying the glass substrate with laser light;
growing a nanocrystalline diamond film of predetermined film thickness on the growth side; and
performing additional etching; thereby forming a plurality of sealed through glass vias within the glass substrate.