US 12,227,348 B2
Resealable film
Scott William Huffer, Hartsville, SC (US); and Rod Pettis, Elgin, SC (US)
Assigned to SONOCO DEVELOPMENT, INC., Hartsville, SC (US)
Filed by SONOCO DEVELOPMENT, INC., Hartsville, SC (US)
Filed on Nov. 9, 2023, as Appl. No. 18/505,553.
Application 18/505,553 is a division of application No. 17/678,624, filed on Feb. 23, 2022, granted, now 11,814,226.
Application 17/678,624 is a continuation of application No. 16/568,491, filed on Sep. 12, 2019, granted, now 11,292,648, issued on Apr. 5, 2022.
Prior Publication US 2024/0076111 A1, Mar. 7, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. B65D 65/40 (2006.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B65D 77/20 (2006.01)
CPC B65D 65/40 (2013.01) [B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/306 (2013.01); B32B 27/32 (2013.01); B65D 77/2096 (2013.01); B32B 2435/02 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A method of forming a flexible film, the method comprising:
coextruding a flexible film comprising:
a polyethylene-based first film layer;
a pressure sensitive adhesive layer adjacent a lower surface of the first film layer;
a polyolefin plastomer skin layer adjacent a lower surface of the pressure sensitive adhesive layer; and
printing a heat seal layer adjacent a lower surface of the skin layer to form a heat-sealable film.