| CPC B60C 23/0452 (2013.01) [B60C 23/0493 (2013.01); G06K 19/07764 (2013.01); H01Q 1/2225 (2013.01); H01Q 1/2241 (2013.01); H01Q 1/48 (2013.01); H01Q 9/0421 (2013.01); H01Q 9/0457 (2013.01)] | 20 Claims |

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1. A radio frequency identification (RFID) sensor device configured to be embedded in, integrated into, or applied to a tire, the device comprising a patch-type antenna that includes a multilayer structure, the multilayer structure comprising:
a bottom ground plane;
an intermediate dielectric substrate arranged on the bottom ground plane;
one or more top conductive patches arranged on the intermediate dielectric substrate and covering partially or completely the intermediate dielectric substrate, wherein the bottom ground plane and the one or more top conductive patches are short-circuited or capacitively coupled;
a rigid or flexible board arranged on the one or more top conductive patches and/or the intermediate dielectric substrate;
an RFID chip installed on the rigid or flexible board and coupled to the one or more top conductive patches;
a temperature sensor integrated into, or connected to, the RFID chip; and
a pressure sensor installed on the rigid or flexible board and connected to the RFID chip;
wherein the bottom ground plane is formed by:
conductive textile/fabric/thread/fiber/yarn elements and/or layers, or by a metal weft/net/mesh; or
at least partially by conductive and/or metal elements and/or layers of the tire;
wherein the intermediate dielectric substrate is made at least partially of rubber, or is formed at least partially by dielectric and/or rubber elements and/or layers of the tire.
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