US 12,226,937 B2
Mold release film, film laminate, method for producing mold release film, and method for producing film laminate
Yosuke Oseki, Tokyo (JP)
Assigned to Mitsubishi Chemical Corporation, Tokyo (JP)
Filed by Mitsubishi Chemical Corporation, Tokyo (JP)
Filed on Jan. 24, 2022, as Appl. No. 17/582,487.
Application 17/582,487 is a continuation of application No. PCT/JP2020/016391, filed on Apr. 14, 2020.
Claims priority of application No. 2019-138531 (JP), filed on Jul. 29, 2019.
Prior Publication US 2022/0143877 A1, May 12, 2022
Int. Cl. B29C 37/00 (2006.01); B32B 7/12 (2006.01); B32B 27/28 (2006.01); C08G 77/08 (2006.01); C08G 77/24 (2006.01); C08J 5/18 (2006.01)
CPC B29C 37/0075 (2013.01) [B32B 7/12 (2013.01); B32B 27/283 (2013.01); C08G 77/08 (2013.01); C08G 77/24 (2013.01); C08J 5/18 (2013.01); B29K 2883/00 (2013.01); B32B 2307/748 (2013.01); C08J 2383/04 (2013.01)] 26 Claims
OG exemplary drawing
 
1. A mold release film, comprising:
a mold release layer formed by curing a mold release layer composition comprising a curable silicone comprising a fluorine substituent, a curable silicone having no fluorine substituent, and a curing catalyst, on at least one surface of a substrate film,
wherein a thickness of the mold release layer after drying is in a range of from 0.05 to 0.25 μm,
wherein a mass ratio of the curable silicone having a fluorine substituent to the curable silicone having no fluorine substituent is in a range of from 1:50 to 10:1, and
wherein, in a concentration distribution of fluorine atoms in a thickness direction within the mold release layer, fluorine atoms are unevenly distributed on a surface of the mold release layer, and a fluorine atom concentration on one side of the mold release layer is 39.0 atom concentration % or more.