US 12,226,892 B2
Compact paired parallel architecture for high-fidelity haptic applications
Margot R. Vulliez, Lavoux (FR); and Oussama Khatib, Stanford, CA (US)
Assigned to The Board of Trustees of the Leland Stanford JuniorUniversity, Stanford, CA (US)
Appl. No. 18/022,208
Filed by The Board of Trustees of the Leland Stanford Junior University, Stanford, CA (US)
PCT Filed Sep. 7, 2021, PCT No. PCT/US2021/049309
§ 371(c)(1), (2) Date Feb. 20, 2023,
PCT Pub. No. WO2022/051726, PCT Pub. Date Mar. 10, 2022.
Claims priority of provisional application 63/076,258, filed on Sep. 9, 2020.
Claims priority of provisional application 63/075,252, filed on Sep. 7, 2020.
Prior Publication US 2023/0311337 A1, Oct. 5, 2023
Int. Cl. B25J 13/02 (2006.01); B25J 9/16 (2006.01); B25J 9/00 (2006.01)
CPC B25J 13/025 (2013.01) [B25J 9/1689 (2013.01); B25J 9/0051 (2013.01)] 1 Claim
OG exemplary drawing
 
1. A haptic device, comprising:
(a) a paired parallel architecture formed by a first parallel translational manipulator and a second parallel translational manipulator together providing a 6-DOF motion of a reversible friction-less helical end-effector of the haptic device to which first and second manipulators are coupled in parallel; and
(b) the reversible friction-less helical end-effector attached to the first and second parallel translational manipulators through two serial kinematic chains enabling a transformation of displacements of the first and second parallel translational manipulators into translational and rotational motions of the reversible friction-less helical end-effector, and transmission of torques from the first and second parallel translational manipulators to generate 6-DOF haptic feedback in an operational space of the haptic device.