CPC B23K 26/032 (2013.01) [B22F 10/28 (2021.01); B22F 10/31 (2021.01); B22F 12/45 (2021.01); B22F 12/90 (2021.01); B23K 26/04 (2013.01); B23K 26/707 (2015.10); B29C 64/393 (2017.08); B22F 10/366 (2021.01); B22F 12/38 (2021.01); B29C 64/153 (2017.08)] | 20 Claims |
1. A laser processing system comprising:
a frame structure;
a work base for supporting a work material, wherein the work base defines a work field in a work plane, wherein the work plane is parallel to the work base;
at least one laser device for projecting a work light on the work plane and/or on the work material, when the work material is disposed on the work base, wherein the at least one laser device is rigidly attached to the frame structure;
wherein each laser device is configured for generating one or more reference marks on the work material and/or on the work plane within a corresponding laser field, wherein the laser field corresponds to at least a part of the work field;
an optical detector for scanning the work field for detecting at least a part of the one or more reference marks generated by each laser device, wherein the optical detector is movable independent from the at least one laser device and is movable with respect to the frame structure with not more than two degrees of freedom; and
a control unit functionally connected to the optical detector and the at least one laser device, wherein the control unit is configured for calibrating the at least one laser device based on the reference marks detected by the optical detector.
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