US 12,226,820 B2
Bonding sheet
Kotaro Masuyama, Tokyo (JP); Kohei Otogawa, Tokyo (JP); Tomohiko Yamaguchi, Tokyo (JP); and Kiyotaka Nakaya, Tokyo (JP)
Assigned to MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
Appl. No. 17/793,465
Filed by MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
PCT Filed Jan. 26, 2021, PCT No. PCT/JP2021/002645
§ 371(c)(1), (2) Date Jul. 18, 2022,
PCT Pub. No. WO2021/153560, PCT Pub. Date Aug. 5, 2021.
Claims priority of application No. 2020-011517 (JP), filed on Jan. 28, 2020.
Prior Publication US 2023/0070283 A1, Mar. 9, 2023
Int. Cl. B22F 1/102 (2022.01); B22F 1/00 (2022.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); H01B 1/22 (2006.01)
CPC B22F 1/102 (2022.01) [B22F 1/00 (2013.01); B23K 35/0233 (2013.01); B23K 35/302 (2013.01); H01B 1/22 (2013.01); B22F 2301/10 (2013.01); Y10T 428/12014 (2015.01)] 12 Claims
OG exemplary drawing
 
1. A bonding sheet comprising a copper particle and a solvent having a boiling point of 150° C. or higher, wherein
the copper particle has a surface covered with an organic protective film,
a content ratio of the copper particle to the solvent is in a range of 99:1 to 90:10 by mass,
a BET diameter of the copper particle is in a range of 50 nm to 300 nm both inclusive,
and a ratio of a C3H3O3− ion to a Cu+ ion on the surface of the copper particle detected by analysis using time-of-flight secondary ion mass spectrometry is 0.001 or greater.