US 12,226,807 B2
Cleaning device for cleaning electroplating substrate holder
Yu-Young Wang, New Taipei (TW); Chung-En Kao, Miaoli County (TW); and Victor Y. Lu, Foster City, CA (US)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Hsin-Chu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Hsin-Chu (TW)
Filed on Aug. 10, 2022, as Appl. No. 17/885,360.
Application 17/885,360 is a division of application No. 16/429,470, filed on Jun. 3, 2019, granted, now 11,433,440.
Application 16/429,470 is a division of application No. 14/839,625, filed on Aug. 28, 2015, granted, now 10,307,798, issued on Jun. 4, 2019.
Prior Publication US 2022/0379356 A1, Dec. 1, 2022
Int. Cl. B08B 17/02 (2006.01); B08B 3/02 (2006.01); C25D 21/08 (2006.01); C25D 17/06 (2006.01); C25D 21/00 (2006.01)
CPC B08B 17/025 (2013.01) [B08B 3/02 (2013.01); C25D 21/08 (2013.01); B08B 2203/0229 (2013.01); C25D 17/06 (2013.01); C25D 21/00 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
performing an electroplating process using a substrate holder to support a substrate on which the electroplating process is performed; and
after the electroplating process, removing contamination on the substrate holder, wherein removing the contamination comprises:
positioning a receiver of a cleaning device such that a first sidewall of the receiver is adjacent a lip seal of the substrate holder, wherein the first sidewall extends from a bottommost surface of the lip seal to a topmost surface of the lip seal; and
spraying a cleaning agent onto a portion of the lip seal through a nozzle disposed on the receiver,
wherein positioning the receiver comprises:
positioning the receiver such that a first portion of a ceiling of the receiver extending from the first sidewall overlies the portion of the lip seal and a bottom of the receiver underlies the portion of the lip seal.