US 12,226,637 B2
Connection mechanism for thin film stimulation leads
Todd Hanson, Brooklyn Park, MN (US); Norbert Kaula, Brooklyn Park, MN (US); Daniel Oster, Brooklyn Park, MN (US); Alanna Hentges, Brooklyn Park, MN (US); Johnny Khith, Brooklyn Park, MN (US); Jeremy Lug, Brooklyn Park, MN (US); Angelo Fruci, Brooklyn Park, MN (US); and Angel Oudomrak, Brooklyn Park, MN (US)
Assigned to Cirtec Medical Corporation, Brooklyn Park, MN (US)
Filed by Cirtec Medical Corporation, Brooklyn Park, MN (US)
Filed on Mar. 25, 2021, as Appl. No. 17/212,283.
Claims priority of provisional application 63/002,857, filed on Mar. 31, 2020.
Prior Publication US 2021/0299451 A1, Sep. 30, 2021
Int. Cl. A61N 1/36 (2006.01); A61N 1/05 (2006.01)
CPC A61N 1/36125 (2013.01) [A61N 1/0553 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A lead assembly, comprising:
a thin film body supporting a plurality of electrodes, wherein the thin film body includes a substrate;
a plurality of electrode connection traces situated on the thin film body and electrically connected to respective ones of the plurality of electrodes;
a connection wire configured to provide electrical signals for transmission to the plurality of electrodes, wherein the connection wire extends from a lumen of a lead and is substantially larger than each of the electrode connection traces; and
a coupling structure configured to provide electrical connection between the connection wire and the electrode connection traces, wherein a first portion of the coupling structure is disposed over a first side of the substrate, and wherein a second portion of the coupling structure is disposed over a second side of the substrate opposite the first side;
wherein the coupling structure includes:
a transition pad that is connected to the connection wire;
a conductive pad that is connected to one of the electrode connection traces; and
a bonding wire that is bonded to both the transition pad and the conductive pad.