US 11,903,175 B2
Power converter with integrated multi-layer cooling
Yang Chen, Kingston (CA); Wenbo Liu, Kingston (CA); Andrew Yurek, Kingston (CA); Bo Sheng, Kingston (CA); Xiang Zhou, Kingston (CA); Yan-Fei Liu, Kingston (CA); Lakshmi Varaha Iyer, Troy, MI (US); Gerd Schlager, Kefermarkt (AT); Michael Neudorfhofer, Sankt Valentin (AT); and Wolfgang Baeck, Sankt Valentin (AT)
Assigned to MAGNA INTERNATIONAL INC., Aurora (CA)
Appl. No. 17/425,351
Filed by MAGNA INTERNATIONAL INC., Aurora (CA)
PCT Filed Jan. 24, 2020, PCT No. PCT/US2020/015034
§ 371(c)(1), (2) Date Jul. 23, 2021,
PCT Pub. No. WO2020/154648, PCT Pub. Date Jul. 30, 2020.
Claims priority of provisional application 62/796,392, filed on Jan. 24, 2019.
Prior Publication US 2022/0087079 A1, Mar. 17, 2022
Int. Cl. H05K 7/20 (2006.01); H02M 3/00 (2006.01)
CPC H05K 7/20927 (2013.01) [H02M 3/003 (2021.05); H05K 7/20272 (2013.01); H05K 7/20509 (2013.01); H05K 7/20872 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A power converter comprising:
a first printed circuit board (PCB) and a second PCB attached to the first PCB, wherein the second PCB is disposed vertically relative to the first PCB;
a liquid cooling mechanism mounted to the first PCB;
a plurality of circuitry components including high-loss circuitry components and low-loss circuitry components, wherein the high-loss circuitry components have higher losses relative to the low-loss circuitry components, wherein the high-loss circuitry components are attached to the first PCB; and
wherein the liquid cooling mechanism is operable to actively cool at least the high-loss circuitry components mounted to the first PCB, wherein the high-loss circuitry components are mounted to an opposite side of the PCB relative to the liquid cooling mechanism,
wherein the low-loss circuitry components are attached to the second PCB,
wherein the first PCB is a lower-most PCB and the second PCB is an upper-most PCB, the lower-most PCB disposed below the upper-most PCB, wherein the liquid cooling mechanism is attached to a bottom surface of the lower-most PCB and the high-loss circuitry components are attached to an upper surface of the lower-most PCB,
wherein the low-loss circuitry components are attached to the upper-most PCB, and
wherein the power converter further includes magnetic components attached to the upper-most PCB.