US 11,903,144 B2
Electronic component and method for producing same
Junichi Koike, Sendai (JP)
Assigned to MATERIAL CONCEPT, INC., Sendai (JP)
Appl. No. 17/421,200
Filed by Material Concept, Inc., Sendai (JP)
PCT Filed Jan. 9, 2020, PCT No. PCT/JP2020/000517
§ 371(c)(1), (2) Date Jul. 7, 2021,
PCT Pub. No. WO2020/145360, PCT Pub. Date Jul. 16, 2020.
Claims priority of application No. 2019-002834 (JP), filed on Jan. 10, 2019.
Prior Publication US 2022/0071024 A1, Mar. 3, 2022
Int. Cl. H05K 3/38 (2006.01); B22F 7/04 (2006.01); C04B 37/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01)
CPC H05K 3/388 (2013.01) [B22F 7/04 (2013.01); C04B 37/025 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01); B22F 2007/042 (2013.01); C04B 2235/32 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for producing an electronic component, the method comprising:
applying a paste to an inorganic substrate,
the paste comprising copper particles, copper oxide particles and/or nickel oxide particles, and inorganic oxide particles having a softening point;
forming a sintered body comprising at least copper through heating in an inert gas atmosphere at a temperature being equal to or higher than a sintering temperature of the copper particles and lower than the softening point of the inorganic oxide particles as well as being in a range of 400° C. or more and 620° C. or less for 5 minutes or more and 60 minutes or less; followed by
performing heating in an inert gas atmosphere at a temperature being equal to or higher than the softening point of the inorganic oxide particles as well as being in a range of 650° C. or more and 870° C. or less for 5 minutes or more and 60 minutes or less.