US 11,903,143 B2
Soldering printed circuits using radiant heat
David Christopher Perna, Sunnyvale, CA (US); Elisa Naseem Haqq, Wilsonville, OR (US); Daniel Tusteh Chian, Los Altos, CA (US); and Kevin The-Hung Pham, Seattle, WA (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on Dec. 20, 2021, as Appl. No. 17/645,247.
Prior Publication US 2023/0199971 A1, Jun. 22, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01)
CPC H05K 3/363 (2013.01) [H05K 1/0277 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/144 (2013.01); H05K 2201/09609 (2013.01); H05K 2203/043 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a first flexible printed circuit comprising a two-dimensional pattern of contacts on a first surface, wherein the two-dimensional pattern of contacts comprises a contact density between 0.5 contacts/mm2 and 4.0 contacts/mm2;
a second flexible printed circuit comprising a corresponding two-dimensional pattern of vias; and
a plurality of solder joints, each solder joint formed between a contact of the two-dimensional pattern of contacts and a corresponding via of the corresponding two-dimensional pattern of vias.