US 11,903,139 B2
High-density soft-matter electronics
Carmel Majidi, Pittsburgh, PA (US); Burak Ozdoganlar, Sewickley, PA (US); Arya Tabatabai, Pittsburgh, PA (US); and Bulent Arda Gozen, Pittsburgh, PA (US)
Assigned to CARNEGIE MELLON UNIVERSITY, Pittsburgh, PA (US)
Filed by CARNEGIE MELLON UNIVERSITY, Pittsburgh, PA (US)
Filed on Feb. 22, 2021, as Appl. No. 17/181,756.
Application 17/181,756 is a division of application No. 15/019,786, filed on Feb. 9, 2016, granted, now 10,945,339.
Claims priority of provisional application 62/176,107, filed on Feb. 9, 2015.
Prior Publication US 2021/0204410 A1, Jul. 1, 2021
Int. Cl. H05K 3/10 (2006.01); H05K 1/02 (2006.01); G03F 7/00 (2006.01); H05K 3/28 (2006.01); H05K 1/16 (2006.01)
CPC H05K 3/107 (2013.01) [G03F 7/0002 (2013.01); H05K 1/0283 (2013.01); B81C 2201/0156 (2013.01); B81C 2201/0159 (2013.01); H05K 1/162 (2013.01); H05K 3/281 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/10015 (2013.01); H05K 2203/0108 (2013.01); H05K 2203/0156 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A soft-matter electronic device, comprising:
an elastomer mold comprising a surface and a depression on the surface,
wherein the depression forms a plurality of microchannels in a shape of an electronic circuit;
a eutectic alloy disposed within the plurality of microchannels,
wherein a layer of non-conductive oxide is disposed on the surface of the elastomer mold outside of the plurality of microchannels,
wherein the eutectic alloy is only present within the plurality of microchannels to form the electronic circuit; and
a barrier covering the microchannels and the layer of non-conductive oxide.