US 11,903,132 B2
Power electronic assembly having a laminate inlay and method of producing the power electronic assembly
Petteri Palm, Stein (DE); Martin Benisek, Regensburg (DE); Liu Chen, Munich (DE); Frank Daeche, Unterhaching (DE); and Josef Maerz, Oberhaching (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Mar. 17, 2023, as Appl. No. 18/122,988.
Application 18/122,988 is a continuation of application No. 16/663,947, filed on Oct. 25, 2019, granted, now 11,632,860.
Prior Publication US 2023/0240012 A1, Jul. 27, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01)
CPC H05K 1/181 (2013.01) [H05K 1/021 (2013.01); H05K 1/0298 (2013.01); H05K 1/0306 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A power electronic assembly, comprising:
a board comprising a plurality of metal layers laminated onto or between electrically insulating layers; and
a laminate inlay embedded in the board and including one or more semiconductor dies embedded in a laminate substrate, the laminate inlay configured to switch a load current,
wherein a first metal layer of the board provides electrical contacts at a first side of the board,
wherein a second metal layer of the board provides a thermal contact at a second side of the board opposite the first side,
wherein a third metal layer of the board is positioned between the first metal layer and the laminate inlay and configured to distribute the load current switched by the laminate inlay,
wherein a fourth metal layer of the board is positioned between the second metal layer and the laminate inlay and configured as a primary thermal conduction path for heat generated by the laminate inlay during switching of the load current,
wherein a first electrically insulating layer of the board separates the fourth metal layer from the second metal layer so that the fourth metal layer is electrically isolated from but thermally connected to the second metal layer.