US 11,903,129 B2
Printed circuit board
Chi Seong Kim, Suwon-si (KR); Won Seok Lee, Suwon-si (KR); Guh Hwan Lim, Suwon-si (KR); Jin Uk Lee, Suwon-si (KR); and Jin Oh Park, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Mar. 10, 2022, as Appl. No. 17/691,772.
Claims priority of application No. 10-2021-0152892 (KR), filed on Nov. 9, 2021.
Prior Publication US 2023/0141270 A1, May 11, 2023
Int. Cl. H05K 1/02 (2006.01); H01L 23/13 (2006.01); H01L 23/66 (2006.01); H05B 45/20 (2020.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01)
CPC H05K 1/119 (2013.01) [H05K 1/183 (2013.01); H05K 3/0035 (2013.01); H05K 3/0038 (2013.01); H05K 3/0044 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09854 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
a first insulating material; and
a second insulating material disposed on one surface of the first insulating material in a stacking direction, and including first and second cavities having depths different from each other,
wherein at least one groove portion is disposed in a side surface, and spaced apart in the stacking direction from a bottom surface, of each of the first and second cavities, and
wherein the at least one groove portion includes an end portion covered by the second insulating material in a direction perpendicular to the stacking direction.