US 11,903,127 B2
Fluoride-based resin prepreg and circuit substrate using the same
Te-Chao Liao, Taipei (TW); Hao-Sheng Chen, Taipei (TW); Chih-Kai Chang, Taipei (TW); and Hung-Yi Chang, Taipei (TW)
Assigned to NAN YA PLASTICS CORPORATION, Taipei (TW)
Filed by NAN YA PLASTICS CORPORATION, Taipei (TW)
Filed on Jul. 21, 2021, as Appl. No. 17/381,201.
Claims priority of application No. 109137039 (TW), filed on Oct. 26, 2020.
Prior Publication US 2022/0132661 A1, Apr. 28, 2022
Int. Cl. H05K 1/03 (2006.01); B32B 27/20 (2006.01); B32B 27/12 (2006.01); B32B 27/32 (2006.01)
CPC H05K 1/0366 (2013.01) [B32B 27/12 (2013.01); B32B 27/20 (2013.01); B32B 27/322 (2013.01); B32B 2250/03 (2013.01); B32B 2250/24 (2013.01); B32B 2250/40 (2013.01); B32B 2264/101 (2013.01); B32B 2264/104 (2013.01); B32B 2264/107 (2013.01); B32B 2264/301 (2020.08); B32B 2457/08 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0275 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A fluoride-based resin prepreg, consisting of:
a reinforced base layer; and
a fluoride-based resin layer covering the reinforced base layer;
wherein the fluoride-based resin layer includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler;
wherein based on a total weight of the fluoride-based resin, the fluoride-based resin consisting of 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA), and 0.1 to 5 wt % of ethylene-tetra-fluoro-ethylene (ETFE);
wherein a flowability of the fluoride-based resin prepreg is 4-16% and a pressing temperature of the fluoride-based resin prepreg is 308-375° C.