CPC H04N 23/54 (2023.01) [G03B 13/36 (2013.01); H04N 23/55 (2023.01)] | 20 Claims |
1. A camera module comprising:
base;
a guide portion disposed on an inner side of the base;
a lens assembly moving along the guide portion; and
a substrate disposed on an outer side of the base,
wherein the lens assembly includes a conductor disposed under a lower surface thereof,
wherein the substrate includes a resonance coil disposed in a region facing the lower surface of the lens assembly and overlapping at least a part of the conductor in a direction perpendicular to an optical axis direction in response to movement of the lens assembly, and
wherein the resonant coil generates a magnetic field by resonating with a resonance frequency, and sensing a position of the lens assembly based on an inductance value that changes according to a change in a strength of the generated magnetic field.
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