US 11,901,944 B2
Power and data transmission to substrate support in plasma chambers via optical fiber
Changyou Jing, Livermore, CA (US); and Fred Egley, Sunnyvale, CA (US)
Assigned to LAM RESEARCH CORPORATION, Fremont, CA (US)
Appl. No. 17/617,517
Filed by LAM RESEARCH CORPORATION, Fremont, CA (US)
PCT Filed Jun. 8, 2020, PCT No. PCT/US2020/036571
§ 371(c)(1), (2) Date Dec. 8, 2021,
PCT Pub. No. WO2020/251876, PCT Pub. Date Dec. 17, 2020.
Claims priority of provisional application 62/859,344, filed on Jun. 10, 2019.
Prior Publication US 2022/0247492 A1, Aug. 4, 2022
Int. Cl. H04B 10/25 (2013.01); H01J 37/32 (2006.01); H04B 10/564 (2013.01); H04B 10/80 (2013.01)
CPC H04B 10/2589 (2020.05) [H01J 37/32935 (2013.01); H04B 10/564 (2013.01); H04B 10/807 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A substrate support assembly configured to support a substrate during substrate processing in a processing chamber, the substrate support assembly comprising:
a first optical receiver embedded in the substrate support assembly to receive a first optical signal and a first optical data through a fiber optic cable;
a power converter embedded in the substrate support assembly to generate DC power based on the first optical signal and the first optical data received by the first optical receiver;
a first circuit embedded in the substrate support assembly to:
receive the DC power from the power converter; and
receive a second data from a sensor disposed in the substrate support assembly in response to the first optical data, the sensor configured to sense a parameter associated with a process performed in the processing chamber; and
a first optical transmitter embedded in the substrate support assembly to transmit the second data as a second optical data through the fiber optic cable.