CPC H02M 7/003 (2013.01) [H02M 7/5388 (2013.01); H02M 7/53875 (2013.01)] | 20 Claims |
1. A power module, comprising:
a first substrate layer that is disposed on a first plane;
a second substrate layer that is disposed on a second plane that is parallel to the first plane;
first and second electrical conductors that are configured to be electrically connected to first and second direct current (DC) reference potentials, respectively, and that extend outwardly from the power module on a third plane that is parallel to the first and second planes;
third, fourth, and fifth electrical conductors that are configured to be electrically connected to first, second, and third alternating current (AC) reference potentials, respectively, and that extend outwardly from the power module on a fourth plane that is parallel to the first, second, and third planes; and
a plurality of dies of switches, respectively, disposed between the first and second substrate layers.
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