US 11,901,659 B2
Terminal material for connectors
Yoshie Tarutani, Naka (JP); and Kenji Kubota, Naka (JP)
Assigned to MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
Appl. No. 17/633,268
Filed by MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
PCT Filed Aug. 3, 2020, PCT No. PCT/JP2020/029688
§ 371(c)(1), (2) Date Feb. 7, 2022,
PCT Pub. No. WO2021/029254, PCT Pub. Date Feb. 18, 2021.
Claims priority of application No. 2019-146951 (JP), filed on Aug. 9, 2019; and application No. 2020-078202 (JP), filed on Apr. 27, 2020.
Prior Publication US 2022/0294140 A1, Sep. 15, 2022
Int. Cl. H01R 13/03 (2006.01); B32B 15/01 (2006.01); C25D 3/64 (2006.01); C22C 5/06 (2006.01); C25D 3/12 (2006.01); C25D 3/46 (2006.01); C25D 5/12 (2006.01)
CPC H01R 13/03 (2013.01) [B32B 15/01 (2013.01); C22C 5/06 (2013.01); C25D 3/12 (2013.01); C25D 3/46 (2013.01); C25D 3/64 (2013.01); C25D 5/12 (2013.01); B32B 2307/732 (2013.01); B32B 2457/00 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A terminal material for connectors comprising
a base material wherein at least a surface layer is made of copper or copper alloy;
a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material; and
a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, having a film thickness 0.5 μm or more and 20.0 μm or less, a nickel content 0.03 at % or more and 1.20 at % or less, and an average crystal grain size 10 nm or more and 150 nm or less.