CPC H01M 10/613 (2015.04) [B23K 26/21 (2015.10); B23K 26/26 (2013.01); B60K 1/00 (2013.01); B60K 1/04 (2013.01); B60L 50/64 (2019.02); B60L 58/21 (2019.02); B62D 21/152 (2013.01); B62D 21/155 (2013.01); H01M 10/625 (2015.04); H01M 50/10 (2021.01); H01M 50/107 (2021.01); H01M 50/116 (2021.01); H01M 50/147 (2021.01); H01M 50/152 (2021.01); H01M 50/166 (2021.01); H01M 50/171 (2021.01); H01M 50/20 (2021.01); H01M 50/213 (2021.01); H01M 50/296 (2021.01); H01M 50/502 (2021.01); H01M 50/505 (2021.01); H01M 50/509 (2021.01); H01M 50/51 (2021.01); H01M 50/516 (2021.01); H01M 50/522 (2021.01); H01M 50/528 (2021.01); H01M 50/529 (2021.01); H01M 50/543 (2021.01); H01M 50/545 (2021.01); B23K 2101/36 (2018.08); B23K 2101/38 (2018.08); B60K 2001/001 (2013.01); B60K 2001/005 (2013.01); B60K 2001/0438 (2013.01); B60K 2001/0461 (2013.01); B60Y 2306/01 (2013.01); B62D 21/18 (2013.01); F16M 1/00 (2013.01); H01M 10/643 (2015.04); H01M 10/6552 (2015.04); H01M 50/244 (2021.01); H01M 50/264 (2021.01); H01M 50/271 (2021.01); H01M 50/572 (2021.01); H01M 2200/103 (2013.01); H01M 2220/20 (2013.01)] | 3 Claims |
1. A method of establishing a direct electrical bond between a bonding connector of a contact plate and a battery cell in a battery module, comprising:
placing the bonding connector into contact with a terminal of the battery cell;
applying a hold-down plate to secure the placed bonding connector onto the terminal, wherein the hold-down plate includes protrusions that are configured to be placed over a set of bonding connectors of the contact plate such that downward force results in the set of bonding connectors being bent downwards so as to be pressed down onto a corresponding set of terminals; and
laser-welding, during the applying, the placed bonding connector to the terminal.
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