US 11,901,494 B2
Packaged LEDs with phosphor films, and associated systems and methods
Jonathon G. Greenwood, Tampa, FL (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Aug. 2, 2021, as Appl. No. 17/391,703.
Application 15/464,596 is a division of application No. 12/819,795, filed on Jun. 21, 2010, abandoned.
Application 17/391,703 is a continuation of application No. 15/464,596, filed on Mar. 21, 2017, granted, now 11,081,625.
Prior Publication US 2021/0359173 A1, Nov. 18, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 33/50 (2010.01); H01L 33/48 (2010.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H01L 27/02 (2006.01); H01L 33/58 (2010.01)
CPC H01L 33/505 (2013.01) [H01L 24/48 (2013.01); H01L 25/167 (2013.01); H01L 33/486 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 27/0248 (2013.01); H01L 33/508 (2013.01); H01L 33/58 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49113 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0041 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for manufacturing an LED assembly, comprising:
mounting an LED to a support member;
electrically connecting the LED to the support member with a wire bond;
heating a self-supporting pre-shaped phosphor film;
applying the heated self-supporting pre-shaped phosphor film to the wire bond, the LED and the support member such that the phosphor film deforms around and completely surrounds the wire bond without changing a location and/or shape of the wire bond; and
curing the phosphor film.