US 11,901,468 B2
Semiconductor packaging including photovoltaic particles having a core-shell structure
Sunggue Lee, Hwaseong-si (KR); and Hyeonwoo Ahn, Seongnam-si (KR)
Assigned to SOFTPV INC., Seongnam-si (KR)
Filed by SOFTPV Inc., Seongnam-si (KR)
Filed on Sep. 29, 2022, as Appl. No. 17/956,123.
Claims priority of application No. 10-2021-0155993 (KR), filed on Nov. 12, 2021.
Prior Publication US 2023/0155040 A1, May 18, 2023
Int. Cl. H01L 31/0224 (2006.01); H01L 31/054 (2014.01); H01L 31/02 (2006.01); H01L 31/048 (2014.01)
CPC H01L 31/022425 (2013.01) [H01L 31/02008 (2013.01); H01L 31/048 (2013.01); H01L 31/054 (2014.12)] 11 Claims
OG exemplary drawing
 
1. A semiconductor packaging comprising:
a power supply part, wherein the power support part is a plurality of photovoltaic particles having a core-shell structure including a core part and a shell part:
a substrate;
a power generation connection layer positioned on the substrate and including external terminals and the plurality of photovoltaic particles;
a semiconductor layer positioned on the power generation connection layer; and
wherein the power generation connection layer electrically connects the substrate to the semiconductor layer.