US 11,901,310 B2
Electronic assembly
Mengzhi Pang, Cupertino, CA (US); Shishuang Sun, Cupertino, CA (US); Ganesh Venkataramanan, Sunnyvale, CA (US); William Arthur McGee, San Jose, CA (US); and Steven Butler, Palo Alto, CA (US)
Assigned to Tesla, Inc., Austin, TX (US)
Appl. No. 17/276,071
Filed by Tesla, Inc., Austin, TX (US)
PCT Filed Sep. 19, 2019, PCT No. PCT/US2019/051944
§ 371(c)(1), (2) Date Mar. 12, 2021,
PCT Pub. No. WO2020/061320, PCT Pub. Date Mar. 26, 2020.
Claims priority of provisional application 62/733,472, filed on Sep. 19, 2018.
Prior Publication US 2022/0051994 A1, Feb. 17, 2022
Int. Cl. H01L 23/34 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01); H01L 23/32 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 25/0652 (2013.01); H01L 25/18 (2013.01); H01L 23/32 (2013.01); H01L 23/5386 (2013.01)] 23 Claims
OG exemplary drawing
 
1. An electronic assembly comprising:
a substrate comprising a first surface and a second surface opposite to the first surface, the substrate further comprising a plurality of substrate interconnects;
a plurality of semiconductor dies mounted on the first surface of the substrate, wherein the plurality of semiconductor dies are electrically connected to each other via the plurality of substrate interconnects;
a plurality of power supply modules mounted on the second surface of the substrate, wherein each power supply module is disposed opposite to a respective semiconductor die; and
a plurality of stiffening members coupled to the substrate, wherein the plurality of stiffening members are configured to control warpage of the substrate, and wherein individual stiffening members comprise:
a first stiffening portion disposed on the first surface of the substrate; and
a second stiffening portion disposed on the second surface of the substrate.