CPC H01L 23/5389 (2013.01) [H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 21/6835 (2013.01); H01L 23/3114 (2013.01); H01L 23/3121 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 23/3128 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/18 (2013.01); H01L 2224/214 (2013.01); H01L 2224/2919 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01)] | 20 Claims |
1. A structure comprising:
a device die;
an encapsulant encapsulating the device die therein;
a through-via penetrating through the encapsulant, wherein the through-via comprises a copper post with substantially straight edges;
a polymer extending into the encapsulant; and
a solder region over and joined to the through-via, wherein both of the polymer and the solder region extend into a recess in the copper post.
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