US 11,901,295 B2
Dielectric film for semiconductor fabrication
Cheng-Yi Wu, Taichung (TW); Li-Hsuan Chu, Taichung (TW); Ching-Wen Wen, Taichung (TW); Chia-Chun Hung, Taichung (TW); Chen Liang Chang, New Taipei (TW); Chin-Szu Lee, Taoyuan (TW); and Hsiang Liu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed on Apr. 4, 2022, as Appl. No. 17/712,306.
Application 16/681,556 is a division of application No. 16/050,058, filed on Jul. 31, 2018, granted, now 11,152,306, issued on Oct. 19, 2021.
Application 16/050,058 is a division of application No. 15/282,258, filed on Sep. 30, 2016, granted, now 10,658,296, issued on May 19, 2020.
Application 17/712,306 is a continuation of application No. 16/681,556, filed on Nov. 12, 2019, granted, now 11,296,027.
Prior Publication US 2022/0223528 A1, Jul. 14, 2022
Int. Cl. H01L 23/48 (2006.01); H01L 23/532 (2006.01); H01L 27/146 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 21/762 (2006.01); H01L 23/528 (2006.01); H01L 23/485 (2006.01)
CPC H01L 23/5329 (2013.01) [H01L 21/0214 (2013.01); H01L 21/0228 (2013.01); H01L 21/02126 (2013.01); H01L 21/02211 (2013.01); H01L 21/02219 (2013.01); H01L 21/02271 (2013.01); H01L 21/76224 (2013.01); H01L 21/76834 (2013.01); H01L 21/76843 (2013.01); H01L 21/76877 (2013.01); H01L 23/481 (2013.01); H01L 23/5283 (2013.01); H01L 23/53223 (2013.01); H01L 23/53238 (2013.01); H01L 27/1463 (2013.01); H01L 27/14614 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 27/14687 (2013.01); H01L 21/76831 (2013.01); H01L 23/485 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A structure, comprising:
a substrate;
a dielectric layer that contains nitrogen or carbon, wherein a concentration of nitrogen or a concentration of carbon varies within the dielectric layer based on a distance away from a bottom surface of the dielectric layer;
a first photo-sensitive element and a second photo-sensitive element disposed over the substrate;
a first color filter and a second color filter disposed over the first photo-sensitive element and over the second photo-sensitive element, respectively; and
a first micro lens and a second micro lens disposed over the first color filter and the second color filter, respectively.