US 11,901,273 B2
Power module with press-fit contacts
Ivan Nikitin, Regensburg (DE); and Peter Luniewski, Poing (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Jul. 26, 2021, as Appl. No. 17/385,731.
Prior Publication US 2023/0026022 A1, Jan. 26, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01R 12/58 (2011.01)
CPC H01L 23/49811 (2013.01) [H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/3171 (2013.01); H01L 23/49833 (2013.01); H01L 23/49844 (2013.01); H01R 12/585 (2013.01); H01L 23/49861 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of forming a semiconductor device, the method comprising:
providing a substrate that comprises a metal region;
forming an encapsulant body of electrically insulating material on an upper surface of the metal region;
forming an opening in the encapsulant body; and
inserting a press-fit connector into the opening;
wherein after inserting the press-fit connector into the opening, the press-fit connector is securely retained to the substrate and an interfacing end of the press-fit connector is electrically accessible,
wherein the encapsulant body is formed by a molding process whereby liquified mold material is formed on the substrate and subsequently hardened, wherein forming the opening comprises arranging a fixed pin over the substrate prior to the molding process, and wherein the fixed pin prevents the liquified mold material from forming at a location corresponding to the opening.