US 11,901,270 B2
Semiconductor device package
Shih-Wen Lu, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Sep. 2, 2020, as Appl. No. 17/010,714.
Prior Publication US 2022/0068774 A1, Mar. 3, 2022
Int. Cl. H01L 23/495 (2006.01); H01P 3/00 (2006.01); H01L 23/538 (2006.01); H01L 23/06 (2006.01)
CPC H01L 23/49575 (2013.01) [H01L 23/06 (2013.01); H01L 23/5384 (2013.01); H01P 3/00 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device package, comprising:
a conductive lid defining a waveguide having a cavity;
a dielectric layer encapsulating the conductive lid and partially disposed within the cavity,
a first conductive via partially penetrating the dielectric layer and connecting a bottom surface of the conductive lid,
wherein the waveguide is configured to transmit a signal from a first electronic component to a second electronic component through the cavity.