US 11,901,258 B2
Iintegrated fan-out packages with embedded heat dissipation structure
Hao-Jan Pei, Hsinchu (TW); Wei-Yu Chen, Taipei (TW); Chia-Shen Cheng, Hsinchu (TW); Chih-Chiang Tsao, Taoyuan (TW); Cheng-Ting Chen, Taichung (TW); Chia-Lun Chang, Tainan (TW); Chih-Wei Lin, Zhubei (TW); Hsiu-Jen Lin, Zhubei (TW); Ching-Hua Hsieh, Hsinchu (TW); and Chung-Shi Liu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Apr. 12, 2021, as Appl. No. 17/227,790.
Application 16/569,898 is a division of application No. 15/940,623, filed on Mar. 29, 2018, granted, now 10,566,261, issued on Feb. 18, 2020.
Application 17/227,790 is a continuation of application No. 16/569,898, filed on Sep. 13, 2019, granted, now 10,978,370.
Claims priority of provisional application 62/586,587, filed on Nov. 15, 2017.
Prior Publication US 2021/0233829 A1, Jul. 29, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/373 (2006.01); H01L 23/50 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01); H01L 23/367 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/3736 (2013.01) [H01L 21/486 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/3677 (2013.01); H01L 23/50 (2013.01); H01L 23/5389 (2013.01); H01L 24/83 (2013.01); H01L 25/105 (2013.01); H01L 23/49816 (2013.01); H01L 2224/18 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor structure comprising:
a die embedded in a molding material, the die having die connectors at a front side of the die;
a conductive pillar laterally adjacent to the die and embedded in the molding material;
a first redistribution structure over the molding material at a backside of the die, the conductive pillar being electrically coupled to the first redistribution structure; and
a heat dissipation structure embedded in the first redistribution structure, wherein the heat dissipation structure extends through the first redistribution structure and is attached to the backside of the die, wherein the heat dissipation structure comprises:
dummy metal patterns embedded in dielectric layers of the first redistribution structure; and
a metal paste extending through the first redistribution structure and contacting the dummy metal patterns.