US 11,901,215 B2
Vacuum wafer chuck for manufacturing semiconductor devices
Chung-Hsien Liao, Hsinchu (TW); and Chin-Shen Hsieh, Hsin-Chu (CN)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on May 4, 2022, as Appl. No. 17/736,926.
Application 17/736,926 is a division of application No. 16/870,336, filed on May 8, 2020, granted, now 11,335,585.
Prior Publication US 2022/0262669 A1, Aug. 18, 2022
Int. Cl. H01L 21/683 (2006.01); B25B 11/00 (2006.01)
CPC H01L 21/6838 (2013.01) [B25B 11/005 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor manufacturing system, comprising:
a substrate holder;
a substrate displacing assembly for displacing a substrate on the substrate holder in a first direction perpendicular to a top surface of the substrate holder, the substrate displacing assembly comprising:
a pair of load forks, wherein the pair of load forks comprises a fork region and a base region;
a coupler, wherein the coupler comprises a flange region and a tube region, wherein the coupler is mechanically coupled to the base region; and
a driving shaft, wherein the driving shaft is mechanically coupled to the coupler,
wherein a clearance distance in a second direction, perpendicular to the first direction, between an inner wall of the tube region of the coupler to a side wall of the driving shaft is greater than 0.1 millimeters.