US 11,901,209 B2
High temperature bipolar electrostatic chuck
Jian Li, Fremont, CA (US); Zheng J. Ye, Santa Clara, CA (US); Dmitry A. Dzilno, Sunnyvale, CA (US); and Juan Carlos Rocha-Alvarez, San Carlos, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Feb. 21, 2023, as Appl. No. 18/172,217.
Application 18/172,217 is a continuation of application No. 17/076,649, filed on Oct. 21, 2020, granted, now 11,587,817.
Prior Publication US 2023/0207371 A1, Jun. 29, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01T 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01J 37/32 (2006.01)
CPC H01L 21/6833 (2013.01) [H01J 37/32724 (2013.01); H01L 21/67103 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/332 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A substrate support assembly comprising:
an electrostatic chuck body defining a substrate support surface;
a first bipolar electrode embedded within the electrostatic chuck body beneath the substrate support surface;
a second bipolar electrode embedded within the electrostatic chuck beneath the substrate support surface, wherein the first bipolar electrode and the second bipolar electrode are separated by a gap;
a third electrode positioned radially outward from and extending about the first bipolar electrode and the second bipolar electrode
a connection for a first radio frequency (RF) power supply or variable capacitor coupled with the first bipolar electrode and/or the second bipolar electrode; and
a connection for a second RF power supply or variable capacitor coupled with the third bipolar electrode.