US 11,901,208 B2
Substrate chuck for self-assembling semiconductor light emitting diodes
Inbum Yang, Seoul (KR); Imdeok Jung, Seoul (KR); Junghun Rho, Seoul (KR); and Bongwoon Choi, Seoul (KR)
Assigned to LG ELECTRONICS INC., Seoul (KR)
Filed by LG ELECTRONICS INC., Seoul (KR)
Filed on Apr. 24, 2020, as Appl. No. 16/857,818.
Claims priority of application No. 10-2019-0115574 (KR), filed on Sep. 19, 2019; and application No. 10-2020-0008857 (KR), filed on Jan. 22, 2020.
Prior Publication US 2021/0090929 A1, Mar. 25, 2021
Int. Cl. H01L 21/68 (2006.01); H01L 21/50 (2006.01); H01L 21/67 (2006.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01); H05K 13/04 (2006.01); H05K 13/02 (2006.01); H01L 21/60 (2006.01)
CPC H01L 21/68 (2013.01) [H01L 21/50 (2013.01); H01L 21/67126 (2013.01); H01L 21/67144 (2013.01); H01L 25/0753 (2013.01); H01L 33/0095 (2013.01); H05K 13/027 (2013.01); H05K 13/046 (2013.01); H05K 13/0478 (2013.01); H01L 2021/6009 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A substrate chuck for allowing one surface of a substrate to be in contact with a fluid in an assembly chamber, the substrate chuck comprising:
a first frame having a first hole at a central portion thereof;
a second frame having a second hole at a central portion thereof and disposed to overlap the first frame, wherein the first frame comprises:
a bottom portion at which the first hole is formed; and
a sidewall portion formed on a peripheral edge of the bottom portion; and
a frame transfer part connected to the second frame and configured to vertically move the second frame with respect to the first frame,
wherein a height of the sidewall portion is greater than a depth at which the substrate is placed into the fluid in the assembly chamber,
wherein the first frame comprises a sealing part disposed at an edge of the first hole,
wherein the first frame and the second frame are configured to be disposed at a first side and a second side of the substrate, respectively with the substrate interposed therebetween, and
wherein the frame transfer part is configured to transfer the second frame so that a first surface of the substrate is in contact with the fluid while the second frame presses on a second surface of the substrate.