US 11,901,201 B2
Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
Shunichi Kawakami, Tokyo (JP); and Takaya Noguchi, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Aug. 15, 2022, as Appl. No. 17/819,848.
Claims priority of application No. 2021-174671 (JP), filed on Oct. 26, 2021.
Prior Publication US 2023/0131572 A1, Apr. 27, 2023
Int. Cl. B32B 43/00 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/67132 (2013.01) [H01L 21/6836 (2013.01); B32B 43/006 (2013.01); Y10T 156/1132 (2015.01); Y10T 156/1179 (2015.01); Y10T 156/1944 (2015.01); Y10T 156/1983 (2015.01)] 22 Claims
OG exemplary drawing
 
1. A semiconductor manufacturing apparatus for separating a semiconductor device attached to a front surface of a sheet from the sheet, comprising
a die having contact with a rear surface of the sheet which is a surface of the sheet on a side opposite to the front surface of the sheet, wherein
the die includes therein a plurality of support blocks, each of which includes a first suction hole formed for sucking the rear surface of the sheet, and a single driver connected to the plurality of support blocks so that the plurality of support blocks can move in a first direction as a direction away from the sheet with a time difference, and
the plurality of support blocks are disposed in the die along a second direction, as a direction of a separation of the semiconductor device from the sheet, intersecting the first direction.