US 11,901,199 B2
Pressurizing device and pressurizing method
Takahiro Mori, Higashimurayama (JP); and Satoshi Idesako, Higashimurayama (JP)
Assigned to NIKKISO CO., LTD., Tokyo (JP)
Filed by NIKKISO CO., LTD., Tokyo (JP)
Filed on Sep. 17, 2020, as Appl. No. 17/024,230.
Application 17/024,230 is a continuation of application No. 16/095,987, granted, now 11,037,790, previously published as PCT/JP2017/005359, filed on Feb. 14, 2017.
Claims priority of application No. 2016-089812 (JP), filed on Apr. 27, 2016.
Prior Publication US 2021/0028018 A1, Jan. 28, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); B29C 43/18 (2006.01); B29C 65/00 (2006.01)
CPC H01L 21/67109 (2013.01) [B29C 43/18 (2013.01); B29C 66/71 (2013.01); H01L 21/67126 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/75 (2013.01); H01L 2224/83101 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A pressurizing apparatus, comprising:
a mounting base on which a target object is mountable;
an upper unit including a base member, which is moveable upward and downward, and an upper mold fixed on the base member and for pressurizing the target object when the target object is mounted on the mounting base from an upper side thereof;
a heating lower mold that is a heated lower mold and is configured to heat the target object while pressurizing it in a state where the mounting base is sandwiched between the upper mold and the heating lower mold;
a cooling lower mold that is a cooled lower mold and is configured to cool the target object while pressurizing it in a state where the mounting base is sandwiched between the upper mold and the cooling lower mold;
a control device configured to control, according to a state of progress in a pressurization processing of the target object, driving of the heating lower mold and the cooling lower mold to switch the one of the heating lower mold and the cooling lower mold contributing to the pressurization of the target object;
a side mold disposed around the upper mold and, when closely contacting with the mounting base, configured to form a hermetically closed space around the target object together with the upper mold and the mounting base; and
a suction apparatus for sucking air from the hermetically closed space to bring a surrounding of the target object into a vacuum state,
wherein the control device is configured, prior to the pressurization of the target object, to bring the side mold into contact with the mounting base to form the hermetically closed space and to drive the suction apparatus to bring the hermetically closed space into the vacuum state.