CPC H01J 37/3417 (2013.01) [C23C 14/46 (2013.01); H01J 37/3464 (2013.01)] | 20 Claims |
1. A method for increased target utilization within a sputtering system comprising the steps of:
providing a plurality of targets, each target of the plurality of targets is operatively connected to a target holder, each target of the plurality of targets is positioned along an outer portion of a generally circular pallet of the sputtering system, the circular pallet having a central axis;
generating a first ion beam within the sputtering system;
directing the first generated ion beam at a first location of a first target;
discontinuing the generation of the first ion beam;
rotating the central axis of the circular pallet;
generating a second ion beam within the sputtering system; and
directing the second generated ion beam at a second location of said first target.
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