US 11,901,164 B2
Micro-surface morphological matching for reactor components
Patrick Whiting, Beaverton, OR (US); Jeffrey L. Young, San Francisco, CA (US); Ryan Wood, Portland, OR (US); Eric Scott, Hillsboro, OR (US); David Laube, Mesa, AZ (US); and Alex Collins, Lebanon, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Oct. 4, 2021, as Appl. No. 17/493,705.
Application 17/493,705 is a division of application No. 15/922,762, filed on Mar. 15, 2018, granted, now 11,139,151.
Prior Publication US 2022/0028668 A1, Jan. 27, 2022
Int. Cl. H01J 37/32 (2006.01); H01L 21/3065 (2006.01); B08B 7/00 (2006.01)
CPC H01J 37/32853 (2013.01) [B08B 7/0028 (2013.01); H01L 21/3065 (2013.01); H01J 2237/334 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A plasma etch process reactor component comprising a metal, wherein:
a surface of the metal comprises aluminum and is substantially free of fluorine;
a morphology of the surface comprises more micropits than abrasion grooves; and
individual ones of the abrasion grooves have a first length at least ten times longer than a first width, and individual ones of the micropits have a diameter that is larger than the first width.