CPC H01J 37/32559 (2013.01) [C23C 16/4405 (2013.01); C23C 16/455 (2013.01); C23C 16/505 (2013.01); H01J 37/3244 (2013.01); H01J 37/32513 (2013.01); H01J 37/32825 (2013.01); H01J 37/32862 (2013.01)] | 5 Claims |
1. A vacuum processing apparatus which performs plasma processing, the vacuum processing apparatus comprising:
an electrode flange connected to a high-frequency power supply;
a shower plate spaced apart from and facing the electrode flange and serving as a cathode together with the electrode flange;
an insulating shield provided around the shower plate;
a processing chamber in which a processing-target substrate is to be disposed in an opposite side of the shower plate opposite with respect to the electrode flange;
an electrode frame attached to the shower plate side of the electrode flange; and
a slide plate attached to a circumferential edge portion of the shower plate on the electrode frame side, wherein
the electrode frame and the slide plate are slidable in response to thermal deformation that occurs when a temperature of the shower plate is raised or lowered, and a space surrounded by the shower plate, the electrode flange, and the electrode frame is sealable,
the shower plate is supported by the electrode frame using a support member penetrating through an elongated hole provided in the circumferential edge portion of the shower plate,
the elongated hole is formed so that the support member is relatively movable in the elongated hole in response to thermal deformation that occurs when a temperature of the shower plate is raised or lowered,
a gas hole which communicates with the elongated hole to supply a purge gas is provided in the elongated hole, and
the gas hole communicates with a space surrounded by the shower plate, the electrode flange, the electrode frame, and the slide plate.
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