CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/224 (2013.01)] | 22 Claims |
1. A multilayer ceramic electronic component comprising:
a ceramic body having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a third direction, the ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked in the third direction with a dielectric layer interposed therebetween;
a first external electrode connected to the first internal electrode which extends from the first surface, and including a first electrode layer, a first conductive layer, and a first metal layer;
a second external electrode connected to the second internal electrode which extends from the second surface, and including a second electrode layer, a second conductive layer, and a second metal layer;
a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer; and
a second coating layer disposed on the ceramic body, the first external electrode, and the second external electrode,
wherein the first conductive layer and the second conductive layer are sintered electrodes including a conductive metal and glass, and the first coating layer includes a plurality of openings disposed on the first electrode layer and the second electrode layer,
the second coating layer includes a first insulating layer and a second layer covering the first insulating layer, and
the first insulating layer and the second layer are disposed on one of the first surface and the second surface to cover an end of the first internal electrode or an end of the second internal electrode.
|