US 11,901,115 B2
Substrate assembly with encapsulated magnetic feature
Kyu-Oh Lee, Chandler, AZ (US); Rahul Jain, Gilbert, AZ (US); Sai Vadlamani, Chandler, AZ (US); Cheng Xu, Chandler, AZ (US); Ji Yong Park, Chandler, AZ (US); Junnan Zhao, Gilbert, AZ (US); and Seo Young Kim, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jul. 26, 2022, as Appl. No. 17/873,509.
Application 17/873,509 is a division of application No. 16/020,035, filed on Jun. 27, 2018, granted, now 11,443,892.
Prior Publication US 2022/0359115 A1, Nov. 10, 2022
Int. Cl. H01F 27/32 (2006.01); H01L 23/498 (2006.01); H01F 41/04 (2006.01); H01L 21/48 (2006.01); H01F 27/28 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01)
CPC H01F 27/327 (2013.01) [H01F 27/2804 (2013.01); H01F 41/043 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/4867 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01F 2027/2809 (2013.01); H01L 21/6835 (2013.01); H01L 24/16 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16267 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19102 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a substrate assembly, comprising:
forming one or more traces on a dummy copper region that is coupled to a dummy core;
forming a first portion of a magnetic feature on the dummy copper region, wherein a portion of the one or more traces is encircled between the first portion of the magnetic feature and the dummy copper region;
forming a first dielectric region on the dummy copper region, wherein the first portion of the magnetic feature is encapsulated between the first dielectric region and the dummy copper region;
removing the dummy copper region and the dummy core;
forming a second portion of the magnetic feature on an opposite side of the one or more traces from which the first portion of the magnetic feature is located, wherein the portion of the one or more traces is encircled between the first portion of the magnetic feature and the second portion of the magnetic feature; and
forming a second dielectric region on the second portion of the magnetic feature, wherein the magnetic feature is encapsulated between the first dielectric region and the second dielectric region.