US 11,900,720 B2
Circuit board and smart card for fingerprint recognition including the same
Seung Joon Kim, Seoul (KR); Yong Hyun Gwon, Seoul (KR); and Yong Hyun Cho, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Filed by LG INNOTEK CO., LTD., Seoul (KR)
Filed on Aug. 31, 2021, as Appl. No. 17/446,541.
Claims priority of application No. 10-2020-0113646 (KR), filed on Sep. 7, 2020.
Prior Publication US 2022/0078906 A1, Mar. 10, 2022
Int. Cl. H05K 1/02 (2006.01); G06V 40/12 (2022.01); G06V 40/13 (2022.01); G06K 19/07 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01)
CPC G06V 40/1365 (2022.01) [G06K 19/0718 (2013.01); G06V 40/13 (2022.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A circuit board comprising:
a substrate including one surface and an other surface;
a first circuit pattern disposed on the one surface;
a second circuit pattern disposed on the other surface,
a first adhesive layer on the one surface of the substrate; and
a second adhesive layer on the other surface of the substrate,
wherein the first circuit pattern directly contacts the first adhesive layer,
wherein the second circuit pattern directly contacts the second adhesive layer,
wherein a plurality of vias are formed in the substrate, and
the first circuit pattern and the second circuit pattern are wire-bonded through one of the vias to conduct electricity.