CPC G06F 30/398 (2020.01) [G03F 1/36 (2013.01); G03F 1/70 (2013.01); G03F 7/705 (2013.01); G03F 7/70433 (2013.01); G03F 7/70441 (2013.01)] | 19 Claims |
1. A method comprising:
accessing a mask pattern for use in a lithography process that prints a pattern on a wafer; and
applying, by a processor, the mask pattern to a deterministic model of the lithography process to predict a characteristic of the printed pattern that is subject to local stochastic variations, comprising:
applying the mask pattern to a deterministic compact model that predicts the characteristic of the printed pattern, wherein the compact model does not account for local stochastic variations of the characteristic; and
applying a deterministic correction to the predicted characteristic from the compact model, wherein the correction accounts for the local stochastic variations of the characteristic in the printed pattern.
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