US 11,899,804 B2
Secure communications amongst connected dice
Alberto Troia, Munich (DE); and Antonino Mondello, Messina (IT)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Oct. 22, 2021, as Appl. No. 17/508,630.
Application 17/508,630 is a continuation of application No. 16/363,132, filed on Mar. 25, 2019, granted, now 11,163,896.
Prior Publication US 2022/0043921 A1, Feb. 10, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 21/60 (2013.01); H04L 9/32 (2006.01); H04L 9/08 (2006.01); H04L 9/06 (2006.01)
CPC G06F 21/606 (2013.01) [H04L 9/0643 (2013.01); H04L 9/0825 (2013.01); H04L 9/0894 (2013.01); H04L 9/3226 (2013.01); H04L 9/3247 (2013.01); H04L 9/3263 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a first die, configured to:
generate a first digital signature according to a first measure of the first die and a first private key;
communicate to a second die, the first measure, the first digital signature, and a first public key; and
the second die, configured to:
validate the first digital signature using the first public key; and
validate the first measure by comparing the first measure to a first validation code.