US 11,899,379 B2
Dynamic generation of layout adaptive packaging
Uwe Hollerbach, Fremont, CA (US); and Thomas L. Laidig, Richmond, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jan. 23, 2023, as Appl. No. 18/158,293.
Application 18/158,293 is a continuation of application No. 17/285,741, granted, now 11,599,032, previously published as PCT/US2019/048627, filed on Aug. 28, 2019.
Application 17/285,741 is a continuation of application No. 16/192,448, filed on Nov. 15, 2018, granted, now 10,678,150, issued on Jun. 9, 2020.
Prior Publication US 2023/0161274 A1, May 25, 2023
Int. Cl. G03F 7/20 (2006.01); G03F 7/00 (2006.01); H01L 21/027 (2006.01)
CPC G03F 7/70991 (2013.01) [G03F 7/70291 (2013.01); G03F 7/70383 (2013.01); G03F 7/70508 (2013.01); H01L 21/0274 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for processing an apparatus in a maskless microlithography system, comprising:
obtaining position data on a component and an aspect of an electrical connection to the component for a designed state;
measuring a stage including the component with at least one device to develop a second set of coordinate data for the component and the electrical connection;
comparing the obtained coordinate data of the component to the second set of coordinate data for the component to determine an offset of the component measured with the at least one device to the designed state;
altering the aspect of the electrical connection to the component based, at least in part, upon the offset prior to forming the electrical connection; and
forming an altered electrical connection on an electrical connection location between the component and a fixed perimeter.